| 发明名称 |
Lead frame and flip packaging device thereof |
| 摘要 |
Disclosed are various lead frame and flip chip package structures. In one embodiment, a method can include: (i) a plurality of pins, wherein each of the plurality of pins includes an intermediate portion and an extension portion that are connected to each other; (ii) where the intermediate portion is located at an interior region of the lead frame, the intermediate portion extending to a first side edge of the lead frame; and (iii) where the extension portion is located at a peripheral region of the lead frame, the peripheral region being different than the first side edge. |
| 申请公布号 |
US8853838(B2) |
申请公布日期 |
2014.10.07 |
| 申请号 |
US201314022877 |
申请日期 |
2013.09.10 |
| 申请人 |
Silergy Semiconductor Technology (Hangzhou) Ltd |
发明人 |
Tan Xiaochun |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
Stephens, Jr. Michael C. |
| 主权项 |
1. A lead frame, comprising:
a) a plurality of pins, wherein each of said plurality of pins comprises an intermediate portion and an extension portion that are connected to each other; b) said intermediate portion being located at an interior region of said lead frame, said intermediate portion comprising a first portion for each of said plurality of pins, each said first portion being arranged in parallel and extending to a first side edge of said lead frame; and c) said extension portion being located at a peripheral region of said lead frame, said peripheral region being different than said first side edge. |
| 地址 |
Hangzhou CN |
