| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition allowing less heat resistance change due to heat history of an obtained cured product, being excellent in low heat expansion, and having low dielectric constant and dielectric tangent, a cured product thereof, and a printed circuit board.SOLUTION: A curable composition is characterized by containing a 3 functional epoxy compound (A1) having a molecular structure represented by the structural formula (1) (where Rand Reach independently represent a hydrogen atom, an alkyl group having a carbon atom number of 1 to 4 or an alkoxy group having a carbon atom number of 1 to 4, and G represents a glycidyl group) and a polyphenylene ether resin (B). |
