发明名称 METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device in which a phosphor is arranged around an LED chip by dropping of a phosphor-containing resin and the light-emitting device suppressing reduction in light flux caused by light scattering due to the phosphor can be manufactured.SOLUTION: A method of manufacturing a light-emitting device 1 includes the steps of: preparing a case 4 having an annular side wall part 4a, and an LED chip 2 including a chip substrate 2a and a crystalline layer 2b which is mounted in a region surrounded by the side wall part 4a of the case 4; and dropping droplets of a charged phosphor-containing resin 5 to fill between the side wall part 4a and the LED chip 2. The droplets are drawn to the side wall part 4a by electrostatic force during dropping.
申请公布号 JP2014192502(A) 申请公布日期 2014.10.06
申请号 JP20130069493 申请日期 2013.03.28
申请人 TOYODA GOSEI CO LTD 发明人 NONOKAWA TAKASHI;TERAYAMA TAKASHI;HAYASHI TOSHIMASA
分类号 H01L33/50;H01L33/54 主分类号 H01L33/50
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