发明名称 METHOD FOR PRODUCING CONDUCTIVE FILM AND CONDUCTIVE FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for producing a conductive film, capable of obtaining a conductive film in which the occurrence of ablation due to pulse light irradiation is suppressed and which has excellent adhesion to a substrate.SOLUTION: The method for producing a conductive film comprises: a substrate treatment step of subjecting a resin substrate to substrate treatment for roughening the resin substrate; a coating film forming step of applying a conductive film forming composition containing copper oxide particles (A) having an average particle diameter of 200 nm or less, a hydrophilic polymer (B), a thixotropic agent (C), and a solvent (D) being water or a hydrophilic alcohol onto the resin substrate subjected to the substrate treatment to form a coating film; and a reduction step of subjecting the coating film to pulse light irradiation treatment to reduce the copper oxide particles (A), thereby forming a conductive film containing copper.</p>
申请公布号 JP2014191974(A) 申请公布日期 2014.10.06
申请号 JP20130066075 申请日期 2013.03.27
申请人 FUJIFILM CORP 发明人 HONGO YUSHI;SASADA MISATO;KARIYA TOSHIHIRO;HAYATA YUICHI
分类号 H01B13/00;H01B5/14;H05K1/09;H05K3/10;H05K3/38 主分类号 H01B13/00
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