| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for formation of an insulating coating such as a solder resist film, which can prevent generation of an undercut in a cured coating film even when the composition is subjected to exposure by use of a direct drawing device that directly draws an image.SOLUTION: The photosensitive resin composition comprises (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a compound having an ethylenic unsaturated group, (D) a non-reactive diluent and (E) an epoxy compound. The composition contains (B-1) an oxime ester compound and (B-2) an aminocarbonyl compound having a tertiary amino as the above (B) photopolymerization initiator.</p> |
