发明名称 PATTERNING METHOD OF SUBSTRATE AND PATTERNING PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a patterning method capable of appropriately forming a processing groove according to a mechanical technique, and a patterning processing device for implementing the patterning method.SOLUTION: A method of patterning a substrate by forming a linear processing groove by removing a part of a membrane layer provided on the substrate while using a scribe tool provided with an edge in its tip includes: a first scribe step of forming a first processing groove at a processing groove formation target position on the substrate while using a first scribe tool capable of forming a processing groove of a processing width narrower than a desired processing width; and a second scribe step of forming a second processing groove, while overlapping the first processing groove, at the processing groove formation target position on the substrate where the first processing groove has been formed, while using a second scribe tool capable of forming a processing groove of the desired processing width.
申请公布号 JP2014192461(A) 申请公布日期 2014.10.06
申请号 JP20130068736 申请日期 2013.03.28
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MORIMOTO MASAMICHI;YAMADA MITSURU
分类号 H01L21/304;H01L31/04 主分类号 H01L21/304
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