发明名称 |
ELECTRON BEAM-CURABLE RESIN COMPOSITION, RESIN FRAME FOR REFLECTOR, REFLECTOR, SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING MOLDED ARTICLE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electron beam-curable resin composition which can develop excellent thermal deformation resistance even in a molded article state, and to provide a resin frame for a reflector, a reflector and a semiconductor light-emitting device using the above resin composition, and a method for manufacturing a molded article using the resin composition.SOLUTION: The electron beam-curable resin composition comprises an olefin resin and a crosslinking agent. The crosslinking agent has a saturated or unsaturated ring structure, in which at least one atom in atoms constituting at least one ring is bonded to an allyl-based substituent that is one of an allyl group, a methallyl group, an allyl group via a connecting group, and a methallyl group via a connecting group. The electron beam-curable resin composition shows a storage modulus (E') of 0.1×10to 5.5×10Pa, at 270°C measured under specific measurement conditions. Also disclosed are a resin frame for a reflector, a reflector, and a semiconductor light-emitting device using the resin composition, and a method for manufacturing a molded article by using the above resin composition. |
申请公布号 |
JP2014189632(A) |
申请公布日期 |
2014.10.06 |
申请号 |
JP20130066100 |
申请日期 |
2013.03.27 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YOSHIDA YASUKI;SAKAYORI KATSUYA;SAKAI TOSHIYUKI;TAKARABE TOSHIMASA;AMAGAI KEI |
分类号 |
C08L23/00;C08J3/24;C08K3/36;C08K5/03;C08K5/3477;H01L23/29;H01L23/31;H01L33/60 |
主分类号 |
C08L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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