| 摘要 |
PROBLEM TO BE SOLVED: To provide resin-sealed electronic equipment capable of preventing an electronic component from being floated by connection expansion caused by reflow processing or the like which is implemented when mounting the resin-sealed electronic equipment onto a mounting substrate.SOLUTION: The resin-sealed electronic equipment comprises: a substrate; an electronic component which is mounted on one principal surface of the substrate via a connection electrode; and a resin-sealed part which is formed on the one principal surface of the substrate by covering the electronic component with a resin. A restraint part is formed on at least one of a mounting-side principal surface and a top surface of the electronic component, the restraint part is filled with the resin, and the resin filling the restraint part and the resin positioned on the one principal surface of the substrate are formed continuously. |
