发明名称 |
METHOD FOR PRODUCING BONDED BODY AND PHOTOSENSITIVE ADHESIVE SHEET |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a bonded body, which can provide a bonded body comprising adherends adhering mutually with sufficient adhesive strength and with occurrence of voids being suppressed, even when a thickness of an adhesive pattern is 100 μm or more.SOLUTION: Provided is a method for producing a bonded body comprising a first adherend and a second adherend mutually bonded with an adhesive pattern interposed therebetween. The method comprises: a step of disposing a photosensitive adhesive layer including two sheets or more of film-like photosensitive adhesive having a thickness of 5 to 90 μm bonded on the first adherend; a step of forming an adhesive pattern by exposing light and developing the photosensitive adhesive layer; and a step of laminating the second adherend on the adhesive pattern. |
申请公布号 |
JP2014189626(A) |
申请公布日期 |
2014.10.06 |
申请号 |
JP20130065996 |
申请日期 |
2013.03.27 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
IKEDA AYA;FUJII SHINJIRO;KIKUCHI SHOGO |
分类号 |
C09J7/00;B32B27/00;C09J4/00;C09J5/00;C09J7/02;C09J11/06;C09J201/00 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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