| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve downsizing by sharing a substrate.SOLUTION: A semiconductor device comprises: a substrate; a first switching element which has a first electrode on a surface side and a second electrode on a rear face side and which is provided on the substrate in an orientation where the first electrode is arranged on the substrate side; a second switching element which has a first electrode on a surface side and a second electrode on a rear face side and which is provided on the substrate in an orientation where the second electrode is arranged on the substrate side; and conductor wires which are provided on the substrate and connected to signal terminals of the first switching element.</p> |
