发明名称 INTERCONNECT STRUCTURE INCLUDING HYBRID FRAME PANEL
摘要 PROBLEM TO BE SOLVED: To provide an electronic component including an interconnect structure.SOLUTION: An electronic component (10) includes a base insulative layer (12) having a first surface (14) and a second surface (16); at least one electronic device (18) having a first surface (20) and a second surface (22) and secured to the base insulative layer; at least one I/O contact (24) located on the first surface of the electronic device; and a frame panel (26) defining an aperture (42). The electronic device is disposed within the aperture, and the frame panel has a multi-functional structure with a first region (28) comprising a first material and a second region (30) comprising a second material. A surface of the first region is secured to the base insulative layer. The first material and the second material differ from each other and have differing adhesiveness to the base insulative layer.
申请公布号 JP2014187406(A) 申请公布日期 2014.10.02
申请号 JP20140141109 申请日期 2014.07.09
申请人 GENERAL ELECTRIC CO <GE> 发明人 FILLION RAYMOND A;BITTING DONALD STEPHEN;ABRAHAM DANIEL LEE
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址