| 摘要 |
A ternary particle size filler composition with addition of nano particles is provided to formulate thermally conductive interface materials such as soft gel having a high thermal conductivity, a relative low viscosity, and a low complex storage modulus. The thermally conductive material containing thermal particle composition and polymer matrix is used to create a thermal transfer path between the electronic component and the heat dissipation member. The composition is a mixture of a ternary particle size fillers constituted of the same or different chemical compounds in a predefined size ranges and volume ratios in terms of low viscosity and thermal interface nominal size. A silicone based polymer used as filler bonding matrix contains base resin, dispersant, cross-linker and polymerization catalyst. Thermal conductivity of the soft gel varied according to the change of volume percentage, particle size, and chemical compound of individual thermal particles. |
| 主权项 |
1. A ternary particle size thermally conductive filler composition with addition of nano particles having:
(A) Composition I comprising controlled particle size ratio and volume percentage ratio as following:
A-1. Large thermally conductive filler has a particle size range from 1-10 um, preferred 4-8 um in an amount of about 40 to 80 volume %, preferred 60 to 65 volume %;A-2. Small thermally conductive filler has a particle size range from 0.1-5 um, preferred 0.5-2 um in an amount of about 5 to 30 volume %, preferred 10 to 15 volume %;A-3. Nano thermally conductive filler has a particle size range from 10-800 nm, preferred 50-300 nm in an amount of about 10 to 40 volume %, preferred 15 to 30 volume %;A-4. Volume ratio of large thermally conductive filler to small thermally conductive filler e. is about 1:2 to 20:1, preferably 2:1 to 10:1;A-5. Volume ratio of large thermally conductive filler o nano thermally conductive filler is about 1:3 to 15:1, preferably 2:3 to 6:1;A-6. Volume ratio of small thermally conductive filler to nano thermally conductive filler is about 5:1 to 1:5, preferably 1:1 to 1:3; (B) Composition II comprising controlled particle size ratio and volume percentage ratio as following:
B-1. Large thermally conductive filler has a particle size range from 20-40 um, preferred 23-28 um in an amount of about 45 to 75 volume %, preferred 58 to 62 volume %.B-2. Small thermally conductive filler has a particle size range from 5-20 um, preferred 8-12 um in an amount of about 5 to 40 volume %, preferred 15 to 25 volume %;B-3. Nano thermally conductive filler has a particle size range from 10-800 nm, preferred 100-300 nm in an amount of about 10 to 50 volume %, preferred 25 to 30 volume %;B-4. Volume ratio of large thermally conductive filler to small thermally conductive filler is about 1:3 to 15:1, preferably 3:2 to 8:1;B-5. Volume ratio of large thermally conductive filler to nano thermally conductive filler is about 1:2 to 10:1, preferably 2:1 to 5:1;B-6. Volume ratio of small thermally conductive filler to nano thermally conductive filler is about 3:2 to 1:4, preferably 1:1 to 1:3. |
