Silicon-Based Heat-Dissipation Device For Heat-Generating Devices

摘要

Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device.

主权项

1. An apparatus, comprising:
a silicon-based heat-dissipation device comprising:
a base portion having a first primary side and a second primary side opposite the first primary side; anda protrusion portion on the first primary side of the base portion and protruding therefrom,wherein the second primary side of the base portion is configured to have one or more heat-generating devices embedded therein or physically coupled thereto such that at least a portion of heat generated by the one or more heat-generating devices is dissipated to the silicon-based heat-dissipation device by conduction.