| 摘要 |
Provided is a laminate for temporary bonding in semiconductor device manufacture which is capable of reliably and easily providing temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed, wherein, even in high-temperature processing, said temporary support can easily be removed without damaging the member when processing has been completed; also provided is a semiconductor device manufacturing method. This laminate for temporary bonding in semiconductor device manufacture has (A) a release layer and (B) an adhesive layer, and the release layer contains (a1) a 25°C liquid compound and (a2) a binder, wherein the temperature at which said compound decreases in weight by 5 mass% when measured under a nitrogen stream under conditions in which the temperature rises at a constant rate of 20°C/min is 250°C or greater, and the temperature at which said binder decreases in weight by 5 mass% when measured under a nitrogen stream under conditions in which the temperature rises at a constant rate of 20°C/min is 250°C or greater. |
