EPOXY RESIN, PRODUCTION METHOD OF EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT OF THE SAME, HEAT-RADIATION RESIN MATERIAL, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin having high thermal conductivity, excellent in adhesiveness to a substrate, flexibility and heat resistance, and useful as a matrix resin for a TIM (thermal interface material) or other electronic equipment materials, and to provide a production method of the epoxy resin, an epoxy resin composition, a cured product of the composition, and a heat-radiation resin material.SOLUTION: The epoxy resin has a molecular structure expressed by general formula (I) shown below. In the formula, A each independently represents a linear or branched alkylene group; Q each independently represents an organic group having a plurality of aromatic nuclei; l represents an integer of 1 to 10; m represents an integer of 1 to 5; n represents an integer of 0 to 3; and G represents a glycidyl group.