MANUFACTURING METHOD OF CIRCUIT STRUCTURE

摘要

A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.

主权项

1. A manufacturing method of a circuit structure, comprising:
providing a metal layer, the metal layer having an upper surface; forming a surface passivation layer on the upper surface of the metal layer, the surface passivation layer exposing a portion of the upper surface of the metal layer, a material of the metal layer being different from a material of the surface passivation layer; and forming a covering layer on the surface passivation layer, the covering layer covering the surface passivation layer.