HALOGEN-FREE, NONFLAMMABLE AND HIGH GLASS TRANSITION TEMPERATURE PHENOLIC RESIN-BASED CURING AGENT AND PROCESS FOR PRODUCING THE SAME

摘要

A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

主权项

1. A phenolic-type phosphorous curing agent, having a molecular weight ranging between 550 and 12000, being halogen-free and nonflammable, and featuring a high glass transition temperature (Tg), characterized in having a chemical structure described as chemical structure formulas (I), (II), (III), (IV) or (V): n is a positive integer greater than zero, and has a value determined by the molecular weight; where, n is a positive integer greater than zero, and has a value determined by the molecular weight; where, n is a positive integer greater than zero, and has a value determined by the molecular weight; where, n is a positive integer greater than zero, and has a value determined by the molecular weight; and G in the above chemical structures (I)-(V) is G1 or G2: