发明名称 |
Charged Particle Beam Apparatus |
摘要 |
The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput. |
申请公布号 |
US2014291510(A1) |
申请公布日期 |
2014.10.02 |
申请号 |
US201414220358 |
申请日期 |
2014.03.20 |
申请人 |
Hermes-Microvision, Inc. |
发明人 |
Chen Zhongwei;Jau Jack;Ren Weiming |
分类号 |
H01J37/26 |
主分类号 |
H01J37/26 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for inspecting a surface of a sample, comprising:
providing a primary electron beam to illuminate and scan said surface of said sample by oblique incidence; providing a first detector to detect backscattered electrons generated from said surface of said sample and traveling towards an incidence side of said primary electron beam; providing an electrode to collect secondary electrons generated from said surface of said sample so as not to hit said first detector,
wherein said first detector has a through hole for said primary electron beam passing through,wherein said electrode is placed close to an illuminated area on said surface of said sample. |
地址 |
Hsinchu TW |