| 发明名称 |
ENCLOSURE SPEAKER WITH SIDE ACOUSTIC EMISSION STRUCTURE |
| 摘要 |
An enclosure speaker with a side acoustic emission structure is provided, which includes: a microspeaker; a lower enclosure case, on which the microspeaker is seated, the lower enclosure case further having a resonance space on the outside of the microspeaker-seated portion; an upper enclosure case coupled to a top of the lower enclosure case; an acoustic passage, a first portion of which being defined in the lower enclosure case and a remaining portion of which being defined in the upper enclosure case, the acoustic passage being made by combining the portion defined in the lower enclosure case and the portion defined in the upper enclosure case; and a mesh disposed on the acoustic passage between the lower enclosure case and the upper enclosure case. |
| 申请公布号 |
US2014294225(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414227396 |
申请日期 |
2014.03.27 |
| 申请人 |
EM-TECH Co., Ltd. |
发明人 |
Ji Yong Ju;Son Jin Geon;Lee Hyun Woo |
| 分类号 |
H04R1/02 |
主分类号 |
H04R1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An enclosure speaker with a side acoustic emission structure, the enclosure speaker comprising:
a microspeaker; a lower enclosure case, on which the microspeaker is seated, the lower enclosure case further having a resonance space on the outside of the microspeaker-seated portion; an upper enclosure case coupled to a top of the lower enclosure case; an acoustic passage, a first portion of which being defined in the lower enclosure case and a remaining portion of which being defined in the upper enclosure case, the acoustic passage being made by combining the portion defined in the lower enclosure case and the portion defined in the upper enclosure case; and a mesh disposed on the acoustic passage between the lower enclosure case and the upper enclosure case. |
| 地址 |
Busan KR |
