| 摘要 |
<p>The present invention provides an active energy ray-curable resin composition that exhibits high close-adhesiveness and excellent wear resistance even under high temperature and high humidity without virtually any warping when cured by ultraviolet rays, electron beam, or other active energy ray, and that has secondary processability such as excellent molding after curing. This active energy ray-curable composition is characterized by containing: a urethane resin having a plurality of acrylate groups or methacrylate groups; at least one amide or amide derivative selected from those having an ethylenic double bond; at least one bifunctional acrylate or bifunctional methacrylate selected from those having a cyclic skeleton containing no carbon-carbon double bond; a photopolymerization initiator; and a polymer containing no ethylenic double bond. This active energy ray-curable composition is characterized if furthermore characterized in that the polymer containing no ethylenic double bond dissolves in at least one amide or amide derivative selected from those having an ethylenic double bond.</p> |
