| 发明名称 |
Integrated Circuit Device Facilitating Package on Package Connections |
| 摘要 |
In embodiments described herein, an integrated circuit (IC) package is provided. The IC package can include a substrate having opposing first and second surfaces, an IC die coupled to the first surface of the substrate, a first plurality of conductive elements coupled to conductive regions on the first surface of the substrate, an interposer having opposing first and second surfaces, and a second plurality of conductive elements coupled to conductive regions on the first surface of the interposer. The second surface of the substrate is configured be coupled to at least one device. Each of the first plurality of conductive elements is electrically coupled to a respective one of the second plurality of conductive elements. The interposer is configured to be attached to a printed circuit board (PCB). |
| 申请公布号 |
US2014291818(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201313850827 |
申请日期 |
2013.03.26 |
| 申请人 |
BROADCOM CORPORATION |
发明人 |
ZHAO Sam Ziqun;Khan Rezaur Rahman |
| 分类号 |
H01L23/552;H01L21/56 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (IC) package, comprising:
a substrate having opposing first and second surfaces; an IC die coupled to the first surface of the substrate, wherein the second surface of the substrate is configured be coupled to at least one device; a first plurality of conductive elements coupled to conductive regions on the first surface of the substrate; an interposer having opposing first and second surfaces; and a second plurality of conductive elements coupled to conductive regions on the first surface of the interposer, wherein each of the first plurality of conductive elements is electrically coupled to a respective one of the second plurality of conductive elements. |
| 地址 |
Irvine CA US |
