CAPACITIVE BLIND-MATE MODULE INTERCONNECTION

摘要

A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture.

主权项

1. A blind-mate capacitive coupling interconnection between a main module enclosure and a sub-module enclosure, comprising:
a first main module capacitive coupling surface provided on a main module outer surface of the main module enclosure; a first sub-module capacitive coupling surface provided on a sub-module outer surface of the sub-module enclosure; the main module capacitive coupling surface and the sub-module capacitive coupling surface each provided with a ground portion with an aperture; a main module inner element provided within the aperture of the main module capacitive coupling surface, electrically isolated from the ground portion of the main module capacitive coupling surface; a sub-module inner element provided within the aperture of the sub-module capacitive coupling surface, electrically isolated from the ground portion of the sub-module capacitive coupling surface; and a mechanical fixture dimensioned to retain the sub-module capacitive coupling surface against the main module capacitive coupling surface.