发明名称 ENERGY RAY-CURABLE RESIN COMPOSITION
摘要 <p>Provided is an energy ray-curable resin composition containing urethane acrylate that can be used as an in-mold molding film and as a coating material for flooring at floor heater locations and the like, the energy ray-curable resin composition having excellent crack resistance and elasticity at high temperature. The energy ray-curable resin composition contains: a urethane (meth)acrylate obtained by reacting (A1) a polycaprolactone diol, a polyether polyol having as the starting compounds (A2-1) an aromatic polyether polyol having an aromatic structure and (A2-2) a trifunctional or higher polyol, (A3) an aromatic polyisocyanate or polyisocyanate that is a mixture of aromatic polyisocyanate and non-aromatic polyisocyanate, and (A4) a (meth)acrylate monomer having one or more hydroxyl groups; and (B) mono(meth)acrylate monomer or mono(meth)acrylamide monomer having a glass transition point of 50°C or higher.</p>
申请公布号 WO2014156581(A1) 申请公布日期 2014.10.02
申请号 WO2014JP56133 申请日期 2014.03.10
申请人 DAI-ICHI KOGYO SEIYAKU CO., LTD. 发明人 KITAZAWA MAKI
分类号 C08F290/06;C09D4/02;C09D175/04 主分类号 C08F290/06
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