An embodiment of the present invention relates to an illumination assembly. The illumination of the embodiment includes: a heat dissipating plate which includes a metal base and heat dissipating pins under the metal base; a light emitting module which includes a printed circuit board on the metal base and light emitting devices arranged on the printed circuit board; a waterproof frame which is arranged along an edge of the printed circuit board; and a light transmitting cover which is arranged on the waterproof frame and the printed circuit board. Outline parts of the heat dissipating pins protrude from the sides of the metal base.
申请公布号
KR101446891(B1)
申请公布日期
2014.10.02
申请号
KR20140066792
申请日期
2014.06.02
申请人
MEC CO., LTD.;KIM, JONG DAE
发明人
KIM, JONG DAE;LEE, JAE YOUNG;JEONG, WOO JUNG;PARK, HYUN SEOK