| 发明名称 |
COMPOSITION FOR FORMING CONDUCTIVE FILM, CONDUCTIVE FILM, AND WIRING BOARD |
| 摘要 |
<p>The purpose of the present invention is to provide a composition for forming a conductive film that can form a conductive film with excellent conduction properties and ion migration suppressing performance, as well as to provide a conductive film and a wiring board. The composition for forming a conductive film of the present invention contains at least metal particles and a migration suppressing agent containing a fluorine atom.</p> |
| 申请公布号 |
WO2014156832(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
WO2014JP57331 |
申请日期 |
2014.03.18 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
MATSUSHITA YASUAKI;MATSUMURA TOKIHIKO |
| 分类号 |
C09D1/00;C09D5/24;C09D7/12;H01B1/22;H01B5/14;H05K3/12 |
主分类号 |
C09D1/00 |
| 代理机构 |
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