Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die

摘要

A semiconductor wafer contains a plurality of semiconductor die separated by a non-active area of the semiconductor wafer. A plurality of contact pads is formed on an active surface of the semiconductor die. A first insulating layer is formed over the semiconductor wafer. A portion of the first insulating layer is removed to expose the contact pads on the semiconductor die. An opening is formed partially through the semiconductor wafer in the active surface of the semiconductor die or in the non-active area of the semiconductor wafer. A second insulating layer is formed in the opening in the semiconductor wafer. A shielding layer is formed over the active surface. The shielding layer extends into the opening of the semiconductor wafer to form a conductive via. A portion of a back surface of the semiconductor wafer is removed to singulate the semiconductor die.

主权项

1. A method of making a semiconductor device, comprising:
providing a semiconductor die; forming an opening around a perimeter and partially through an active surface of the semiconductor die; and forming a conductive layer over the active surface of the semiconductor die and into the opening to operate as a shielding layer over the semiconductor die.