| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal type flowmeter that prevents pollutants from adhering to a flow rate detecting part.SOLUTION: The present invention is a method for manufacturing a thermal type flowmeter 300 having a circuit package 400 in which a semiconductor chip 602 is molded with resin. The method comprises a step of molding, with resin, the semiconductor chip 602, while a die 703 is pressed on a heat-transfer surface 437 provided on the semiconductor chip 602 and a pressing surface 602a set on the surface of the semiconductor 602 and at a position separating from the heat-transfer surface 437. |
