| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition retaining sufficient adhesive strength even when adhering to a hardly adhesive metal, to provide a circuit board with the epoxy resin composition as an insulating layer, and a light-emitting device. <P>SOLUTION: The epoxy resin composition includes a high molecular weight epoxy resin having a molecular weight of 1,000-10,000, a low molecular weight epoxy resin having a molecular weight of 300-500 and a curing agent containing an ether bond in the molecule. The high molecular weight epoxy resin is any of a bisphenol A type epoxy resin and a bisphenol F type epoxy resin, or a copolymer of the bisphenol A type epoxy resin and the bisphenol F type epoxy resin, and has an epoxy group at the terminal of its skeleton. The low molecular weight epoxy resin is a single body or combined body of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a hydrogenated bisphenol A type epoxy resin and a hydrogenated bisphenol F type epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
