发明名称 |
ETCHING LIQUID FOR FORMING TEXTURE |
摘要 |
In the present invention, by using an etching liquid for silicon wafers, which comprises an aqueous solution containing (A) an alkali component and (B) a phosphonic acid derivative or a salt thereof, a good texture can be stably and uniformly formed on a wafer surface. The present invention provides a texture-forming etching liquid for silicon wafers, which is applicable to both wafers cut by a loose abrasive grain system and wafers cut by a fixed abrasive grain system with no vaporization of additive components in the region of working temperatures of from 60° C. to 95° C. |
申请公布号 |
KR20140116193(A) |
申请公布日期 |
2014.10.01 |
申请号 |
KR20147022327 |
申请日期 |
2013.02.06 |
申请人 |
DAI-ICHI KOGYO SEIYAKU CO., LTD. |
发明人 |
NAKAGAWA KAZUNORI;KIGASAWA SHIGERU;NABESHIMA TOSHIKAZU |
分类号 |
H01L31/18;H01L21/308;H01L31/0236;H01L31/04 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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