发明名称 ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
摘要 An electronic component module includes a wiring board on which at least one electronic component is mounted, an outer layer portion that is made of prepreg and covers the wiring board so that all of the at least one mounted electronic component is not exposed, and a terminal portion that is exposed from the outer layer portion to the outside and is configured to electrically connected to a mating connection member.
申请公布号 EP2783555(A1) 申请公布日期 2014.10.01
申请号 EP20120813558 申请日期 2012.11.22
申请人 YAZAKI CORPORATION 发明人 TAKAGI, YUSUKE
分类号 H05K1/11;H05K3/28 主分类号 H05K1/11
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