Semiconductor element housing package and semiconductor device equipped with the same

摘要

A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.

主权项

1. A semiconductor element housing package, comprising:
a substrate; a frame body disposed on the substrate; an insulating substrate disposed in a region of the substrate, the region being surrounded with the frame body; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate being spaced away from the first mounting member; a first lead member passing through the frame body from an exterior thereof, comprising a first bend and making connection with the first mounting member through the first bend; and a second lead member passing through the frame body from the exterior thereof, comprising a second bend and making connection with the second mounting member through the second bend.