发明名称 |
Nonvolatile memory device and method for manufacturing the same |
摘要 |
According to one embodiment, a method is disclosed for manufacturing a nonvolatile memory device. The method can include forming a second stacked body, removing the second stacked body formed in a region where a first memory unit will be formed, forming a first stacked body, and removing the first stacked body formed in a region where a second memory unit will be formed. The method can include simultaneously processing the first stacked body formed in a region where the first memory unit will be formed and the second stacked body formed in a region where the second memory unit will be formed to form a memory cell of the first memory unit from the first stacked body and form a memory cell of the second memory unit from the second stacked body. |
申请公布号 |
US8848455(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US201113236853 |
申请日期 |
2011.09.20 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Noma Kenji |
分类号 |
G11C11/34;H01L29/788;H01L27/22;H01L27/115;G11C11/16;H01L29/66;H01L21/28;G11C13/00;G11C16/04;G11C29/00;G11C11/00 |
主分类号 |
G11C11/34 |
代理机构 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A nonvolatile memory device, comprising:
a first memory unit; and a second memory unit having a data erase temperature higher than a data erase temperature of the first memory unit, the first memory unit being a spin injection MRAM, wherein the first memory unit includes a first magnetic layer, a second magnetic layer, and a nonmagnetic layer placed between the first magnetic layer and the second magnetic layer, and the first magnetic layer and the second magnetic layer are a stacked layer of a layer using TbCoFe and a layer using CoFeB. |
地址 |
Tokyo JP |