发明名称 Nonvolatile memory device and method for manufacturing the same
摘要 According to one embodiment, a method is disclosed for manufacturing a nonvolatile memory device. The method can include forming a second stacked body, removing the second stacked body formed in a region where a first memory unit will be formed, forming a first stacked body, and removing the first stacked body formed in a region where a second memory unit will be formed. The method can include simultaneously processing the first stacked body formed in a region where the first memory unit will be formed and the second stacked body formed in a region where the second memory unit will be formed to form a memory cell of the first memory unit from the first stacked body and form a memory cell of the second memory unit from the second stacked body.
申请公布号 US8848455(B2) 申请公布日期 2014.09.30
申请号 US201113236853 申请日期 2011.09.20
申请人 Kabushiki Kaisha Toshiba 发明人 Noma Kenji
分类号 G11C11/34;H01L29/788;H01L27/22;H01L27/115;G11C11/16;H01L29/66;H01L21/28;G11C13/00;G11C16/04;G11C29/00;G11C11/00 主分类号 G11C11/34
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A nonvolatile memory device, comprising: a first memory unit; and a second memory unit having a data erase temperature higher than a data erase temperature of the first memory unit, the first memory unit being a spin injection MRAM, wherein the first memory unit includes a first magnetic layer, a second magnetic layer, and a nonmagnetic layer placed between the first magnetic layer and the second magnetic layer, and the first magnetic layer and the second magnetic layer are a stacked layer of a layer using TbCoFe and a layer using CoFeB.
地址 Tokyo JP