| 发明名称 | Abrading agent and abrading method | ||
| 摘要 | A polishing agent which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein the amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is at least 0.10 mol with respect to 1 kg of the composition without the organic acid, and the organic acid contains at least two carboxyl groups, wherein the logarithm of the inverse of the first acid dissociation constant (pKa1) is no greater than 3. | ||
| 申请公布号 | US8845915(B2) | 申请公布日期 | 2014.09.30 |
| 申请号 | US201013201518 | 申请日期 | 2010.01.22 |
| 申请人 | Hitachi Chemical Company, Ltd. | 发明人 | Ono Hiroshi;Shinoda Takashi;Okada Yuuhei |
| 分类号 | C03C15/00;H01L21/321;C09G1/02;H01L21/768;C09K3/14 | 主分类号 | C03C15/00 |
| 代理机构 | Westerman, Hattori, Daniels & Adrian, LLP | 代理人 | Westerman, Hattori, Daniels & Adrian, LLP |
| 主权项 | 1. A polishing agent for copper which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein: the amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is at least 0.10 mol with respect to 1kg of the composition without the organic acid, and the organic acid contains at least two carboxyl groups, wherein the logarithm of the inverse of the first acid dissociation constant (pKa1) is no greater than 3; “wherein the protective film-forming agent is at least one protective film-forming agent selected from the group consisting of benzotriazole and its derivatives”. | ||
| 地址 | Tokyo JP | ||