CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a method for manufacturing a circuit board. The method for manufacturing a circuit board according to an embodiment of the present invention includes a step of preparing a metal plate, a step of preparing an electronic component having one surface where an electrode terminal is formed, a step of locating the electronic component on the metal plate to touch each other by allowing an anisotropic conductive film (ACF) to be interposed between the metal plate and an electrode terminal, a step of forming an insulating layer which covers the electronic component on the metal plate, and a step of forming a circuit structure which is electrically connected to the electronic component in the insulating layer.