发明名称 RESIDUAL METAL REMOVAL METHOD AND RESIDUAL METAL REMOVAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a residual metal removal method and a residual metal removal device capable of removing a residual metal film formed on a substrate in a short time and easily.SOLUTION: A residual metal removal device 1 comprises a holding base 2 for holding a substrate K with which a residual metal film K1 is formed on a surface to be processed, a moving mechanism 3 for moving the holding base 2, a feeding roller 4 for feeding out an adhesive sheet 8 with which an adhesive layer is formed on one side, a winding roller 5 for winding the adhesive sheet 8, a pressing roller 6 disposed between the feeding roller 4 and the winding roller 5, and the like. A surface of the residual metal film K1 is adhered to the adhesive layer of the adhesive sheet 8 and while winding the adhesive sheet 8 around the winding roller 5, the holding base 2 is moved in a direction in parallel with the surface to be processed by the moving mechanism 3, such that the residual metal film K1 is exfoliated from the surface to be processed.
申请公布号 JP2014183249(A) 申请公布日期 2014.09.29
申请号 JP20130057759 申请日期 2013.03.21
申请人 SUMITOMO PRECISION PROD CO LTD 发明人 YAMAGUCHI MASATAKA
分类号 H01L21/304;A47L25/00;H01L21/3205;H01L21/768;H01L23/522 主分类号 H01L21/304
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