| 摘要 |
The present invention provides a low shaped multilayer ceramic capacitor having excellent warpage strength. A low shaped multilayer ceramic capacitor (10) allows the thickness dimension (t11c) of each protection dielectric layer (11c) of a dielectric chip (11) and the thickness dimension (t12b) of the reinsertion part of each outer electrode (12) to satisfy the condition of t11c<t12b. |
