METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor element capable of improving dimensional accuracy even if a design dimension of a junction gap between a substrate and the semiconductor element is large when mounting the semiconductor element on the substrate, and a semiconductor device.SOLUTION: A method for mounting a semiconductor element on a substrate comprises the steps of: depositing a first solder joint material on a substrate-side pad formed in the substrate; supplying a second solder joint material having a lower melting point than the first solder joint material onto the first solder joint material; arranging the semiconductor element so that the element-side pad formed in the semiconductor element faces the corresponding substrate-side pad and a prescribed junction gap is provided between the semiconductor element and the substrate; and jointing the first solder joint material and the second solder joint material by reflowing them at a reflow temperature lower than a melting point of the first solder joint material and higher than a melting point of the second solder joint material (reflow step).