SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which can accelerate filling of an encapsulation resin without influencing device reliability and manufacturing cost even when flip chip bonding is used.SOLUTION: A manufacturing method of a semiconductor device 200 of the present embodiment comprises: preparing a semiconductor chip 203 which has a plurality of bump electrodes 225 formed on one surface and through holes 227 arranged among the plurality of bump electrodes 225; mounting the semiconductor chip 203 on a wiring board 201 so as to electrically connect the plurality of bump electrodes 225 to a plurality of connection pads 217 formed on the wiring board 201; and filling an encapsulation resin 211a through the through holes 227 of the semiconductor chip 203 to between the semiconductor chip 203 and the wiring board 201 and among the plurality of bump electrodes 225.