| 摘要 |
A wafer-level technique to couple an optical fiber to an integrated photonic circuit is presented. A connector is fabricated on top of a substrate. The connector comprises hollow structures with high aspect ratio. The connector receives an optical fiber or a ribbon of optical fibers for connection to the integrated photonic circuit. The connector is made with a certain angle to achieve optimal coupling. The base of connector is aligned to a coupler on the substrate. Light can propagate in both directions from the fiber to the chip or from the chip to the fiber. |
