| 发明名称 |
MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE |
| 摘要 |
The present invention is directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a method including capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency. |
| 申请公布号 |
US2014284217(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201414294837 |
申请日期 |
2014.06.03 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Mutnury Bhyrav M.;Cases Moises;Na Nanju;Kim Tae Hong |
| 分类号 |
H01L21/48;C25D5/02 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency. |
| 地址 |
Armonk NY US |
