STRUCTURE AND PROCESS OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent a conductive pattern and a second resin layer from peeling in a structure formed by forming a conductive pattern on a first resin layer and molding a second resin layer thereon.SOLUTION: A structure (10) includes further an insulating adhesion layer (3) between a conductive pattern (2) and a second resin layer (4), wherein the adhesion layer (3) satisfies that adhesion to the conductive pattern (2) is higher than that of the second resin layer (4) or that adhesion to the second resin layer (4) is higher than that of the conductive pattern (2), or satisfies both of them.