| 发明名称 |
INTERLEAVED HEAT SINK AND FAN ASSEMBLY |
| 摘要 |
According to embodiments of the invention, a structure for cooling electronic components may be provided. The structure may include a heat sink having a plurality of parallel heat conducting elements. The structure may also include a plurality of fans, wherein the fans are interleaved with the heat conducting elements. The structure may also include a drive shaft passing through the heat conducting elements and the fans, wherein the drive shaft rotates the fans in relation to the heat sink. According to other embodiments, the structure may include a baffle located on a side of the heat sink in an upstream location within an airflow stream. |
| 申请公布号 |
US2014284030(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201313849725 |
申请日期 |
2013.03.25 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Gilliland Don A.;Johnson David B.;Mann Phillip V. |
| 分类号 |
H05K7/20;B23P15/26 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An assembly for cooling electronic components comprising:
a heat sink having a plurality of parallel heat conducting elements; a plurality of fans, wherein the fans are interleaved with the heat conducting elements; and a drive shaft passing through the heat conducting elements and the fans, wherein the drive shaft rotates the fans in relation to the heat sink. |
| 地址 |
Armonk NY US |
