METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE

摘要

This method for manufacturing a power-module substrate is provided with the following steps: a first lamination step in which a copper sheet (22) is laminated to one side of a ceramic substrate (11) with an active-metal material (26) and a filler material (25) interposed therebetween, the melting point of said filler material (25) being less than or equal to 660°C; a second lamination step in which an aluminum sheet (23) is laminated to the other side of the ceramic substrate (11) with a bonding material (27) interposed therebetween; and a heat-treatment step in which the laminated ceramic substrate (11), copper sheet (22), and aluminum sheet (23) are heat-treated. The copper sheet (22) and the aluminum sheet (23) are bonded to the ceramic substrate (11) simultaneously.