PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING SUBSTRATE WITH RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

This photosensitive resin composition contains a binder polymer (component (A)), a photopolymerizable compound (component (B)), a photopolymerization initiator (component (C)), and a compound that has a (poly)ethylene oxide as a structural unit (component (D)). The binder polymer (component (A)) has (A1) a structural unit which is derived from at least one substance that is selected from the group consisting of styrene, styrene derivatives, benzyl (meth)acrylate and benzyl (meth)acrylate derivatives, and the content of the structural unit in the total solid content of the binder polymer is 10-60% by mass. In addition, the content of the (poly)ethylene oxide structural unit relative to the total solid content of the component (A) and the component (B) is 25% by mass or more.