| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a conductive pattern, by which a wiring line as thin as about 15 μm or less can be formed through a small number of steps.SOLUTION: A method for forming a wiring pattern is provided, which includes steps in the following order: a step of laminating a substrate 20 with a photosensitive conductive film 10 having a support film 1, a conductive film 2 disposed on the support film 1, and photosensitive resin layer 3 disposed on the conductive film 2, while arranging the photosensitive resin layer 3 to be located in the substrate 20 side; a step of partially irradiating the photosensitive resin layer 3 with active rays; a step of peeling the support film 1 and developing the photosensitive resin layer 3 so as to partially remove the photosensitive resin layer 3 together with the conductive film 2 and to form a cured resin pattern and a conductive pattern 2a disposed on the cured resin pattern; and a step of forming a metal layer that partially covers the conductive pattern 2a by electroless plating. |
