THIN FILM SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

The invention provides a method for manufacturing a thin film substrate. The method comprises steps of: providing a substrate having at least one through hole; forming a first metallic layer on a surface of the substrate and the through holes; forming a resist layer and a first opening on the first metallic layer; forming a second metallic layer in the first opening and the through hole; removing the resist layer and a part of the first metallic layer to form a circuit layer and a plurality of grooves; forming a solder mask layer on the circuit layer and in the groove, and forming a second opening on the solder mask layer to expose a part of the circuit layer; and polishing the surface of the exposed circuit layer and the solder mask layer.

主权项

1. A method of manufacturing a thin film substrate comprising steps of:
(a) providing a substrate; (b) forming at least one through hole in the substrate; (c) forming a first metallic layer on a surface of the substrate and the through hole; (d) forming a resist layer and a first opening on the first metallic layer by a process including exposure and development of laminating film, wherein the first opening exposes a part of the first metallic layer; (e) forming a second metallic layer in the first opening and the through hole by a plating process; (f) removing the resist layer; (g) removing the first metallic layer other than beneath the second metallic layer to form a circuit layer and a plurality of grooves on the substrate; (h) forming a solder mask layer on the circuit layer and in the groove, wherein the solder mask includes at least one second opening to expose a part of the circuit layer; and (i) polishing the surface of the exposed circuit layer and the solder mask layer to form a height of the solder mask layer being equal to or slightly lower than that of the circuit layer.