| 摘要 |
PROBLEM TO BE SOLVED: To reduce warpage of a heat dissipation substrate and cracking of an insulating layer that occurs during the manufacturing process and during period of use after manufacture of the heat dissipation substrate, while making the insulating layer exhibit high denseness, high withstand voltage, high adhesion, and high thermal conductivity, in a heat dissipation substrate including an insulating layer formed by blasting technique accompanied by heat treatment.SOLUTION: A base part including a metal object containing a metal as a main component, and a substrate containing ceramic as a main component, in which the metal object is embedded in the substrate so as to penetrate the substrate, is employed. An insulating layer is disposed in at least a partial region of the surface of the substrate where the metal object is exposed. |
