发明名称 PROCESSING SYSTEM AND METHOD FOR PROVIDING A HEATED ETCHING SOLUTION
摘要 <p>Embodiments of the invention provide a processing system and a method for processing a substrate with a heated etching solution. In one example, tight control over temperature and water content of an acidic etching solution is provided. According to one embodiment, the method includes forming the heated etching solution in a first circulation loop, providing the heated etching solution in the process chamber for treating the substrate, forming an additional heated etching solution in a second circulation loop, and supplying the additional heated etching solution to the first circulation loop. According to one embodiment, the processing system includes a process chamber for treating the substrate with the heated etching solution, a first circulation loop for providing the heated etching solution into the process chamber, and a second circulation loop for forming an additional heated etching solution and supplying the additional heated etching solution to the first circulation loop.</p>
申请公布号 WO2014151778(A1) 申请公布日期 2014.09.25
申请号 WO2014US26432 申请日期 2014.03.13
申请人 TEL FSI, INC 发明人 SIEFERING, KEVIN L.;INHOFER, WILLIAM P.
分类号 C03C15/00;C03C25/68 主分类号 C03C15/00
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