| 摘要 |
<p>Provided is a heat pump device that heats a second heat medium to a high temperature with high efficiency by using a secondary-loop refrigeration cycle while achieving a cooling operation and a heating operation simultaneously in a state where reliability and efficiency are ensured. In a heat pump device 100, a heat medium relay unit 3 and a water heating unit 300 are each provided with two connection ports (i.e., connection ports 51 a and 51 b, connection ports 305a and 305b) that are connectable to refrigerant pipes 311, a refrigerant circuit A and a refrigerant circuit C are connected to each other via a heat exchanger 304 included in the water heating unit 300, and a second heat medium is heated in a heat exchanger 302.</p> |
