发明名称 SYSTEM AND METHOD FOR HEATING PLASMA EXPOSED SURFACES
摘要 <p>A substrate support device for a plasma processing system includes a dielectric material layer having a top surface and a bottom surface. The substrate is defined to be supported in order to expose the top surface of the dielectric material to plasma. The device includes optical fibers each of which has a first end part and a second end part. Each first end part of the optical fibers is defined to receive photons from a photon source. The second end part is aligned to allow the photons received from the photon source to be put onto the bottom surface of the dielectric material.</p>
申请公布号 KR20140113610(A) 申请公布日期 2014.09.24
申请号 KR20140031308 申请日期 2014.03.17
申请人 LAM RESEARCH CORPORATION 发明人 POVOLNY HENRY;DHINDSA RAJINDER
分类号 H01L21/205;H01L21/324;H01L21/683 主分类号 H01L21/205
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